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Toyota, Nissan, and Honda Join Forces on AI and Chip Development for Next-Gen Vehicles
Toyota, Nissan, and Honda have teamed up to develop cutting-edge AI and semiconductor technologies for next-generation vehicles, focusing on areas like semiconductor chips, APIs, virtual simulation, and cybersecurity. Supported by Japan's Ministry of Economy, Trade, and Industry, this collaboration aims to enhance Japan's competitiveness in the evolving automotive industry. The initiative includes forming the Advanced SoC Research for Automotive (ASRA) group, involving 12 companies, to create high-performance system-on-chip (SoC) technologies for mass production by 2030, marking a significant advancement in software-defined vehicles (SDVs) and autonomous driving capabilities
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8.16.2024
Vietnam: France Eye High Cooperation Prospects in Hydrogen Development
Vietnam and France are enhancing their partnership in hydrogen energy development, highlighted by Hydrogen de France (HDF Energy) inaugurating its first fuel cell factory in Bordeaux, France. This collaboration leverages Vietnam's renewable energy resources to produce green hydrogen, potentially positioning the country as a significant player in the global hydrogen economy. The partnership is expected to drive innovation, support sustainable energy solutions, and strengthen economic and environmental ties between the two nations.
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8.15.2024
JEDEC Nears Finalization of HBM4 Standard and Set to Double Memory Channels
JEDEC is nearing completion of the HBM4 standard, a significant advancement in memory technology. This new standard doubles the number of channels compared to its predecessor, HBM3, dramatically increasing data transfer rates. While HBM4 offers higher capacity and performance, it also requires a larger physical footprint. This breakthrough will revolutionize high-performance computing, particularly in AI and graphics processing, enabling faster processing of complex algorithms and larger datasets. As the industry eagerly awaits the finalization of HBM4, manufacturers and developers are preparing to harness its potential and shape the future of computing.
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8.14.2024
VinFast Starts Construction of New EV Plant in Indonesia
VinFast Auto, a leading Vietnamese EV manufacturer, has begun constructing a new assembly plant in Subang City, Indonesia, marking a key step in its Southeast Asian expansion. The strategically located facility aims to capitalize on Indonesia's growing EV market and commitment to green energy, enhancing VinFast's global presence. This investment underscores VinFast's commitment to sustainable development, while also contributing to local economic growth and Indonesia's carbon reduction goals.
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8.14.2024
Dell and HP Plan to Gradually Shift PC Production Capacity Out of China
HP and Dell have successively announced major supply chain adjustment plans, involving large-scale relocation of production capacity in China, supply chain adjustments and possible re-positioning in Asia, which will help companies to reduce the uncertainties brought about by geopolitical fluctuations.
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8.14.2024
5G to Power Half of All Vehicles by 2030 as Qualcomm Leads the Charge
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8.13.2024
The World's Largest 200mm Silicon Carbide Power Semiconductor Plant Opened in Malaysia
Malaysia’s high-tech business is expanding rapidly. Infineon Technologies has officially opened the first phase of its new plant (Factory 3) in Kulim, Malaysia, marking the birth of the world’s largest 200mm silicon carbide power semiconductor wafer fab.
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8.13.2024
Rocket Lab Secures $23.9M CHIPS Act Funding to Boost Semiconductor Production in New Mexico
Rocket Lab has secured $23.9 million in federal funding to expand its New Mexico facility for producing space-grade solar cells. The expanded production of these crucial components will strengthen U.S. semiconductor supply chains, supporting both national security and commercial space missions, while positioning New Mexico as a hub for advanced manufacturing.
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8.12.2024
Viksit Bharat 2047: India Must Develop Its Own Chipset Value Chain, Says S Krisnan
At the Viksit Bharat 2047 summit, S Krisnan emphasized the need for India to develop its own chipset value chain. Key strategies include investing in R&D, building advanced fabrication facilities, developing a skilled workforce, and fostering public-private partnerships. These efforts aim to ensure India achieves semiconductor sovereignty by 2047, positioning it as a global industry leader.
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8.9.2024
Hong Kong Is Building Its First Third-generation Semiconductor Gallium Nitride Epitaxial Wafer Pilot Line
With the launch of the third-generation semiconductor gallium nitride GaN epitaxial wafer pilot line in Hong Kong, the cooperation between Hong Kong Science and Technology Park Corporation and Massachusetts Photonics Technology marks an important progress in Hong Kong's microelectronics industry and new industrialization path. This visual presentation symbolizes Hong Kong's ambition and future potential in the semiconductor field and demonstrates the vision of technological innovation and industrial upgrading.
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8.9.2024
Vietnam to Become a Regional Hub for Testing and Assembling High-Tech Products
Vietnam is positioning itself to become a key center for testing and assembling high-tech products in the region. The country aims to leverage its growing technological capabilities and competitive advantages to attract investment and establish itself as a significant player in the high-tech sector. This move aligns with Vietnam's broader economic strategy to enhance its role in the global supply chain and increase its technological expertise. The development is expected to boost the local economy, create job opportunities, and foster innovation in the region.
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