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Intel Expands Chengdu Packaging and Testing Base
Published: 11.5.2024
Intel recently announced the expansion of its packaging and testing base in Chengdu, aiming to deepen its service commitment to the Chinese market and accelerate the response to local customers' demand for high-performance server chips and customized solutions.
According to Intel's official website, Intel began to set up factories in Chengdu in 2003, and the packaging and testing base is located in Chengdu High-tech Comprehensive Bonded Zone. The chipset factory of the first phase project began construction in February 2004 and was completed and put into production at the end of 2005.
The products have been exported to all parts of the world. The second phase of the project started in August 2005 and was completed in October 2006. The training center has been put into use, and the microprocessor factory was put into production in 2007 to package and test Intel's most advanced multi-core microprocessor products.
At present, Intel Products (Chengdu) Co., Ltd. is one of its largest chip packaging and testing centers in the world. More than half of Intel's mobile processors and semi-finished chips in the world are produced in Intel Chengdu. At the same time, Intel has also built a wafer pre-processing production line in Chengdu, which is one of Intel's three largest wafer pre-processing factories in the world.
