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Texas Instruments AM3352BZCZD30
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Dimensions
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Height
1.4 mm
Length
15 mm
Thickness
900 µm
Width
15 mm
Physical
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Case/Package
BGA
Contact Plating
Copper, Silver, Tin
Number of Pins
324
Supply Chain
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Lifecycle Status
Production
Technical
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Core Architecture
ARM
Data Bus Width
32 b
Frequency
300 MHz
Interface
CAN, Ethernet, I2C, SPI, UART, USB
Max Frequency
300 MHz
Max Operating Temperature
125 °C
Memory Size
64 kB
Memory Type
ROM
Min Operating Temperature
-40 °C
Number of Cores
1
Number of Timers/Counters
10
Number of UART Channels
6
RAM Size
64 kB
Voltage
1.144 V