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Texas Instruments AM3352BZCZ100
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
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Height
1.4 mm
Length
15 mm
Thickness
900 µm
Width
15 mm
Physical
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Case/Package
BGA
Contact Plating
Copper, Silver, Tin
Number of Pins
324
Weight
1.713814 g
Supply Chain
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Lifecycle Status
Production
Technical
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Core Architecture
ARM
Data Bus Width
32 b
Frequency
1 GHz
Interface
CAN, Ethernet, I2C, SPI, UART, USB
Max Frequency
1 GHz
Max Junction Temperature (Tj)
90 °C
Max Operating Temperature
90 °C
Max Supply Voltage
3.465 V
Memory Size
128 kB
Memory Type
DDR2, DDR3
Min Operating Temperature
0 °C
Min Supply Voltage
900 mV
Number of ADC Channels
8
Number of Cores
1
Number of Ethernet Channels
2
Number of I2C Channels
3
Number of PWM Channels
3
Number of SPI Channels
2
Number of UART Channels
6
Number of USB Channels
2
RAM Size
64 kB
Voltage
1.144 V