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onsemi FDN352AP
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
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Height
1.22 mm
Length
2.92 mm
Width
1.4 mm
Physical
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Case/Package
TO-236-3
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
3
Supply Chain
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Lifecycle Status
Production
Technical
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Continuous Drain Current (ID)
-1.3 A
Current
13 A
Current Rating
-1.3 A
Drain to Source Breakdown Voltage
-30 V
Drain to Source Resistance
180 mΩ
Drain to Source Voltage (Vdss)
-30 V
Dual Supply Voltage
-30 V
Element Configuration
Single
Fall Time
15 ns
Gate to Source Voltage (Vgs)
25 V
Input Capacitance
150 pF
Max Junction Temperature (Tj)
150 °C
Max Operating Temperature
150 °C
Max Power Dissipation
500 mW
Min Operating Temperature
-55 °C
Nominal Vgs
-2 V
Number of Channels
1
Number of Elements
1
Packaging
Cut Tape
Power Dissipation
500 mW
Rds On Max
180 mΩ
Resistance
180 MΩ
Rise Time
15 ns
Termination
SMD/SMT
Threshold Voltage
-2 V
Turn-Off Delay Time
10 ns
Turn-On Delay Time
4 ns
Voltage
30 V
Voltage Rating (DC)
-30 V