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NXP Semiconductors LPC1114FHI33/302,5
Product Details
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Compliance
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Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
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Height
850 µm
Length
5.1 mm
Width
5.1 mm
Physical
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Case/Package
QFN
Mount
Surface Mount
Number of Pins
32
Technical
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Core Architecture
ARM
Data Bus Width
32 b
Frequency
50 MHz
Interface
I2C, SPI, UART, USART
Max Frequency
50 MHz
Max Operating Temperature
85 °C
Max Power Dissipation
1.5 W
Max Supply Voltage
3.6 V
Memory Size
32 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
1.8 V
Number of ADC Channels
8
Number of I/Os
28
Number of I2C Channels
1
Number of Programmable I/O
28
Number of PWM Channels
13
Number of SPI Channels
1
Number of Timers/Counters
4
Number of UART Channels
1
Operating Supply Voltage
3.3 V
RAM Size
8 kB
Watchdog Timer
Yes