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NXP Semiconductors LPC1111FHN33/201,5
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Dimensions
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Height
950 µm
Length
7.1 mm
Width
7.1 mm
Physical
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Mount
Surface Mount
Number of Pins
33
Technical
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Core Architecture
ARM
Data Bus Width
32 b
Frequency
50 MHz
Interface
950 µm
Max Frequency
50 MHz
Max Operating Temperature
85 °C
Max Power Dissipation
85 °C
Max Supply Voltage
3.6 V
Memory Size
8 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of ADC Channels
8
Number of I/Os
28
Number of I2C Channels
1
Number of Programmable I/O
28
Number of SPI Channels
1
Number of Timers/Counters
4
Number of UART Channels
1
Peripherals
I2C
RAM Size
4 kB
Watchdog Timer
Yes