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NXP Semiconductors DSPB56374AE
Product Details
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Compliance
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Halogen Free
Halogen Free
Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Physical
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related specs
Case/Package
LQFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
52
Weight
374.4972 mg
Technical
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Data Bus Width
24 b
Frequency
150 MHz
Interface
I2C, SPI
Max Frequency
150 MHz
Max I/O Voltage
3.3 V
Max Operating Temperature
110 °C
Max Supply Voltage
110 °C
Memory Size
24 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of Bits
24
Operating Supply Voltage
3.3 V
RAM Size
54 kB