.png){kind=logo}
NXP Semiconductors DSP56F826BU80E
Product Details
Find similar products
Compliance
Select to search
related specs
related specs
Halogen Free
Halogen Free
Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Physical
Select to search
related specs
related specs
Case/Package
LQFP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
100
Weight
650.39476 mg
Technical
Select to search
related specs
related specs
Core Architecture
ARM
Data Bus Width
16 b
Density
512 kb
Frequency
80 MHz
Interface
EBI/EMI, SCI, SPI
Max Frequency
80 MHz
Max I/O Voltage
3.3 V
Max Operating Temperature
85 °C
Max Supply Voltage
85 °C
Memory Size
64 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
-40 °C
Number of I/Os
46
Number of Programmable I/O
46
Number of Timers/Counters
2
Oscillator Type
External
Peripherals
POR, WDT
RAM Size
9 kB
Termination
SMD/SMT