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NXP Semiconductors BZA862AVL,115
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
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Depth
1.35 mm
Height
6.35 mm
Length
2.2 mm
Width
6.35 mm
Physical
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Case/Package
SOT-353
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
5
Weight
4.535924 g
Supply Chain
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Lifecycle Status
Obsolete
Technical
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Breakdown Voltage
5.89 V
Capacitance
22 pF
Clamping Voltage
4 V
Direction
Unidirectional
Leakage Current
100 nA
Max Breakdown Voltage
6.51 V
Max Operating Temperature
150 °C
Max Power Dissipation
24 W
Max Surge Current
850 mA
Min Breakdown Voltage
5.89 V
Min Operating Temperature
-65 °C
Number of Channels
4
Number of Elements
4
Operating Supply Voltage
6.2 V
Packaging
Tape and Reel
Peak Pulse Current
850 mA
Polarity
Unidirectional
Power Dissipation
300 mW
Reverse Standoff Voltage
4 V
Termination
SMD/SMT
Working Voltage
6.51 V