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NXP Semiconductors BGA2869,115
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Physical
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Case/Package
TSSOP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
6
Technical
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Frequency
2.2 GHz
Gain
32.2 dB
Max Frequency
3.2 GHz
Max Operating Temperature
125 °C
Max Power Dissipation
200 mW
Max Supply Voltage
5.5 V
Min Operating Temperature
-40 °C
Min Supply Voltage
4.5 V
Noise Figure
3.2 dB
Number of Channels
1
Operating Supply Current
24 mA
Operating Supply Voltage
5 V
P1dB
9 dBm
Packaging
Tape and Reel
Power Dissipation
200 mW
Test Frequency
2.15 GHz