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NXP Semiconductors BGA2803,115
Product Details
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Compliance
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Radiation Hardening
No
RoHS
Compliant
Physical
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Case/Package
TSSOP
Mount
Surface Mount
Number of Pins
6
Technical
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Core Architecture
PIC
Data Bus Width
8 b
Frequency
2.2 GHz
Gain
23 dB
Interface
I2C, SPI
Max Frequency
3 GHz
Max Operating Temperature
125 °C
Max Power Dissipation
200 mW
Max Supply Voltage
3.3 V
Memory Size
3.5 kB
Memory Type
FLASH
Min Operating Temperature
-40 °C
Min Supply Voltage
2.7 V
Noise Figure
3.4 dB
Nominal Supply Current
5.8 mA
Number of Channels
1
Number of Programmable I/O
11
Number of Timers/Counters
3
Operating Supply Current
5.8 mA
Operating Supply Voltage
3 V
P1dB
-8 dBm
Packaging
Cut Tape
Power Dissipation
200 mW
RAM Size
128 B
Test Frequency
2.15 GHz
Watchdog Timer
Yes