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NXP Semiconductors BGA2716,115
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
RoHS
200 mW
Physical
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Case/Package
TSSOP
Contact Plating
Tin
Mount
Surface Mount
Number of Pins
6
Weight
6.010099 mg
Technical
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Frequency
50 MHz
Gain
22.9 dB
Max Power Dissipation
200 mW
Max Supply Voltage
6 V
Noise Figure
5.3 dB
Nominal Supply Current
21 mA
Number of Channels
1
Operating Supply Current
15.9 mA
Operating Supply Voltage
5 V
P1dB
8.9 dBm
Packaging
Digi-Reel®
Power Dissipation
Digi-Reel®
Test Frequency
1 GHz