NXP Semiconductors BF861B,215
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
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Height
1 mm
Length
3 mm
Width
1.4 mm
Physical
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Case/Package
SOT-23
Mount
Surface Mount
Number of Pins
3
Weight
200.998119 mg
Technical
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Breakdown Voltage
-25 V
Continuous Drain Current (ID)
15 mA
Current Rating
15 mA
Drain to Source Voltage (Vdss)
25 V
Element Configuration
Single
Gate to Source Voltage (Vgs)
25 V
Max Operating Temperature
150 °C
Max Power Dissipation
250 mW
Min Operating Temperature
-65 °C
Packaging
Cut Tape
Power Dissipation
250 mW
Termination
SMD/SMT
Voltage Rating
25 V