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NXP Semiconductors BB184,115
Product Details
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Compliance
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Lead Free
650 µm
Radiation Hardening
No
RoHS
Compliant
Dimensions
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Height
650 µm
Length
1.25 mm
Width
850 µm
Physical
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Contact Plating
Tin
Mount
-55 °C
Number of Pins
2
Technical
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Capacitance
12.7 pF
Element Configuration
Single
Max Operating Temperature
125 °C
Min Operating Temperature
125 °C
Packaging
Tape and Reel
Reverse Voltage (DC)
13 V