NXP Semiconductors BB170X
Product Details
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Compliance
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RoHS
Compliant
Physical
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Case/Package
SOD-323-2
Contact Plating
Tin
Mount
-55 °C
Number of Pins
2
Technical
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Capacitance
2.6 pF
Element Configuration
Single
Forward Current
20 mA
Max Operating Temperature
125 °C
Min Operating Temperature
125 °C
Packaging
Tape & Reel (TR)
Reverse Voltage (DC)
30 V
Termination
SMD/SMT