.png){kind=logo}
NXP Semiconductors BAP70-02,115
Product Details
Find similar products
Compliance
Select to search
related specs
related specs
Lead Free
650 µm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
Select to search
related specs
related specs
Height
650 µm
Length
1.25 mm
Width
850 µm
Physical
Select to search
related specs
related specs
Case/Package
SOD
Contact Plating
Tin
Mount
-65 °C
Number of Pins
2
Technical
Select to search
related specs
related specs
Diode Type
PIN - Single
Element Configuration
Single
Forward Current
100 mA
Forward Voltage
1.1 V
Max Current Rating
100 mA
Max Operating Temperature
150 °C
Max Power Dissipation
150 °C
Max Repetitive Reverse Voltage (Vrrm)
50 V
Max Reverse Voltage (DC)
50 V
Min Operating Temperature
-65 °C
Packaging
Cut Tape
Power Dissipation
415 mW
Reverse Voltage
50 V
Reverse Voltage (DC)
50 V
Termination
SMD/SMT
Test Current
100 mA