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NXP Semiconductors BAP64-04W,115
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
240 mW
RoHS
Compliant
Dimensions
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Height
1 mm
Length
2.2 mm
Width
1.35 mm
Physical
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Case/Package
SC
Contact Plating
Tin
Mount
-65 °C
Number of Pins
3
Technical
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Forward Current
100 mA
Forward Voltage
1.1 V
Max Current Rating
100 mA
Max Operating Temperature
150 °C
Max Power Dissipation
150 °C
Min Operating Temperature
-65 °C
Packaging
Digi-Reel®
Power Dissipation
Digi-Reel®
Reverse Voltage
100 V
Reverse Voltage (DC)
100 V