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NXP Semiconductors BAP64-03,115
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Dimensions
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Height
1.05 mm
Length
1.8 mm
Width
1.35 mm
Physical
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Contact Plating
Tin
Mount
-65 °C
Number of Pins
2
Technical
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Diode Type
PIN - Single
Element Configuration
Single
Forward Current
100 mA
Forward Voltage
1.1 V
Max Current Rating
100 mA
Max Operating Temperature
150 °C
Max Power Dissipation
150 °C
Max Repetitive Reverse Voltage (Vrrm)
175 V
Max Reverse Voltage (DC)
175 V
Min Operating Temperature
-65 °C
Packaging
Cut Tape
Power Dissipation
500 mW
Reverse Voltage
175 V
Reverse Voltage (DC)
175 V
Termination
SMD/SMT
Test Current
100 mA