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NXP Semiconductors BAP51-02,115
Product Details
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Compliance
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Lead Free
650 µm
Radiation Hardening
No
RoHS
Compliant
Dimensions
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Height
650 µm
Length
1.25 mm
Width
850 µm
Physical
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Case/Package
SOD
Contact Plating
Tin
Mount
-65 °C
Number of Pins
2
Technical
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Diode Type
PIN - Single
Element Configuration
Single
Forward Current
50 mA
Forward Voltage
1.1 V
Max Current Rating
50 mA
Max Operating Temperature
150 °C
Max Power Dissipation
150 °C
Min Operating Temperature
-65 °C
Packaging
Cut Tape (CT)
Power Dissipation
715 mW
Reverse Voltage
60 V
Reverse Voltage (DC)
60 V