NXP Semiconductors BAP50-03,135
Product Details
Find similar products
Compliance
Select to search
related specs
related specs
Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Physical
Select to search
related specs
related specs
Case/Package
SOD-323-2
Contact Plating
Tin
Mount
-65 °C
Number of Pins
2
Technical
Select to search
related specs
related specs
Diode Type
PIN - Single
Element Configuration
Single
Forward Current
50 mA
Forward Voltage
1.1 V
Max Current Rating
50 mA
Max Operating Temperature
150 °C
Max Power Dissipation
150 °C
Min Operating Temperature
-65 °C
Packaging
Tape and Reel
Power Dissipation
500 mW
Reverse Voltage
50 V
Reverse Voltage (DC)
50 V