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NXP Semiconductors BAP50-03,115
Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
500 mW
RoHS
Compliant
Dimensions
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Height
6.35 mm
Length
6.35 mm
Width
6.35 mm
Physical
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Case/Package
SOD
Contact Plating
Tin
Mount
-65 °C
Number of Pins
2
Weight
4.535924 g
Technical
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Diode Type
PIN - Single
Element Configuration
Single
Forward Current
50 mA
Forward Voltage
1.1 V
Max Current Rating
50 mA
Max Operating Temperature
150 °C
Max Power Dissipation
150 °C
Min Operating Temperature
-65 °C
Packaging
Digi-Reel®
Power Dissipation
Digi-Reel®
Reverse Voltage
50 V
Reverse Voltage (DC)
50 V