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NXP Semiconductors BAP1321-02,115
Product Details
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Compliance
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Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
Physical
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Contact Plating
Tin
Mount
Surface Mount
Number of Pins
2
Technical
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Diode Type
PIN - Single
Element Configuration
Single
Forward Current
100 mA
Forward Voltage
950 mV
Max Current Rating
100 mA
Max Operating Temperature
150 °C
Max Power Dissipation
715 mW
Min Operating Temperature
-65 °C
Packaging
Digi-Reel®
Power Dissipation
Digi-Reel®
Reverse Voltage
60 V
Reverse Voltage (DC)
60 V