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EPCOS B82498F3821J

Ind Chip Molded Wirewound 820nH 5% 25MHz 23Q-Factor Ceramic 180mA 0805 Blister T/R

Product Details

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Compliance

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Ratings
AEC-Q200
RoHS
Compliant

Dimensions

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Depth
1.9 Ω
Height
1.4 mm
Height - Seated (Max)
1.397 mm
Length
5 %
Width
1.7 mm

Physical

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Case Code (Imperial)
0805
Case Code (Metric)
2012
Case/Package
0805
Core Material
Ceramic
Mount
-55 °C
Number of Pins
2
Weight
IBS

Technical

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Composition
Wirewound
Current Rating
180 mA
DC Current
180 mA
DC Resistance (DCR)
1.9 Ω
Inductance
820 nH
Inductance Tolerance
5%
Max DC Current
180 mA
Max Operating Temperature
150 °C
Military Standard
150 °C
Min Operating Temperature
-55 °C
Packaging
Cut Tape (CT)
Q Factor
7228806
Self Resonant Frequency
300 MHz
Shielding
Unshielded
Termination
SMD/SMT
Test Frequency
25 MHz
Tolerance
5 %

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