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EPCOS B82498F3390J

Ind Chip Molded Wirewound 39nH 5% 250MHz 65Q-Factor Ceramic 600mA 0805 Blister T/R

Product Details

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Compliance

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Lead Free
Lead Free
Ratings
AEC-Q200
RoHS
Compliant

Dimensions

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Depth
1.7 mm
Height
1.4 mm
Height - Seated (Max)
1.397 mm
Length
2.3 mm
Width
1.7018 mm

Physical

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Case Code (Imperial)
0805
Case Code (Metric)
2012
Case/Package
0805
Core Material
Ceramic
Mount
Surface Mount
Number of Pins
2
Weight
5.499807 mg

Technical

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Composition
Wirewound
Current Rating
600 mA
DC Current
600 mA
DC Resistance (DCR)
120 mΩ
Inductance
39 nH
Inductance Tolerance
5%
Max DC Current
600 mA
Max Operating Temperature
150 °C
Military Standard
Not
Min Operating Temperature
-55 °C
Packaging
Cut Tape (CT)
Q Factor
65
Self Resonant Frequency
2.1 GHz
Shielding
Unshielded
Termination
SMD/SMT
Test Frequency
250 MHz
Tolerance
5 %

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