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EPCOS B82498F3279K

Ind Chip Molded Wirewound 2.7nH 10% 250MHz 50Q-Factor Ceramic 1A 0805 Blister T/R

Product Details

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Compliance

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Lead Free
Lead Free
Ratings
AEC-Q200
RoHS
Compliant

Dimensions

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Depth
30 mΩ
Height
1.4 mm
Height - Seated (Max)
1.397 mm
Length
2.3 mm
Width
1.7 mm

Physical

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Case Code (Imperial)
0805
Case Code (Metric)
2012
Case/Package
0805
Core Material
Ceramic
Mount
-55 °C
Weight
IBS

Technical

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Composition
Wirewound
Current Rating
1:00 AM
DC Current
1 A
DC Resistance (DCR)
1 A
Inductance
2.7 nH
Max DC Current
1:00 AM
Max Operating Temperature
1 A
Military Standard
150 °C
Min Operating Temperature
-55 °C
Packaging
Cut Tape (CT)
Q Factor
387868
Self Resonant Frequency
9 GHz
Shielding
Unshielded
Termination
SMD/SMT
Test Frequency
250 MHz
Tolerance
10 %

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