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Product Details
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Compliance
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Lead Free
Lead Free
Radiation Hardening
No
RoHS
Compliant
Dimensions
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Height
740 µm
Length
5 mm
Width
5 mm
Physical
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Case/Package
FBGA
Contact Plating
Copper, Silver, Tin
Number of Pins
56
Supply Chain
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Lifecycle Status
Production
Technical
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Access Time
48 µs
Core Architecture
8051
Data Bus Width
8 b
Data Rate
12 Mbps
Frequency
48 MHz
Interface
I2C, USART, USB
Max Frequency
48 MHz
Max Operating Temperature
70 °C
Max Power Dissipation
300 mW
Max Supply Voltage
3.6 V
Memory Type
EPROM, ROMless
Min Operating Temperature
0 °C
Min Supply Voltage
3 V
Number of Channels
1
Number of I/Os
24
Number of Timers/Counters
3
Operating Supply Voltage
3.3 V
Packaging
Bulk
RAM Size
16 kB